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System Description

 

Wireless Power Transfer

General

Version 1.1 Addendum B5

This page is intentionally left blank.

4

© Wireless Power Consortium, July 2012

 

System Description

 

Wireless Power Transfer

Version 1.1 Addendum B5

Power Transmitter Designs

2 Power Transmitter Designs

This Section contains the definition of the new Power Transmitter design B5. The provisions in this Section will be integrated into [Part 1] in a next release of this System Description Wireless Power Transfer.

2.1.1Power Transmitter design B5

Figure 2-1 illustrates the functional block diagram of Power Transmitter design B5, which consists of two major functional units, namely a Power Conversion Unit and a Communications and Control Unit.

Communications

& Control Unit

Input Power

Inverter

Power

Impedance

Conversion

Matching

Unit

 

Sensing

 

Multiplexer

 

Primary

 

Coil Array

 

Figure 2-1: Functional block diagram of Power Transmitter design B5

The Power Conversion Unit on the right-hand side of Figure 2-1 comprises the analog parts of the design. The design uses an array of partly overlapping Primary Coils to provide for Free Positioning. Depending on the position of the Power Receiver, the multiplexer connects and/or disconnects the appropriate Primary Coils. The impedance matching network forms a resonant circuit with the parts of the Primary Coil array that are connected. The sensing circuits monitor (amongst others) the Primary Cell current and voltage, and the inverter converts the DC input to an AC waveform that drives the Primary Coil array.

The Communications and Control Unit on the left-hand side of Figure 2-1 comprises the digital logic part of the design. This unit receives and decodes messages from the Power Receiver, configures the multiplexer to connect the appropriate parts of the Primary Coil array, executes the relevant power control algorithms and protocols, and drives the inverter to control the amount of power provided to the Power Receiver. The Communications and Control Unit also interfaces with the other subsystems of the Base Station, e.g. for user interface purposes.

© Wireless Power Consortium, July 2012

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System Description

 

Wireless Power Transfer

Power Transmitter Designs

Version 1.1 Addendum B5

2.1.1.1Mechanical details

Power Transmitter design B5 includes a Primary Coil array as defined in Section 2.1.1.1.1, Shielding as defined in Section 2.1.1.1.2, and an Interface Surface as defined in Section 2.1.1.1.3.

2.1.1.1.1Primary Coil array

The Primary Coil array consists of partly overlapping square shaped planar coils. Figure 2-2(a) shows a top view of a single Primary Coil, which consists of a bifilar trace that runs through 11 square shaped turns in a single layer of a PCB. Another realization of a single Primary Coil is to construct it from Litz wire having 24 strands of no. 40 AWG (0.08 mm diameter), or equivalent.. Figure 2-2(b) shows a top view of such wire-wound Primary Coil. Table 2-1 lists the relevant parameters of the coils shown in Figure 2-2.

 

rc

90

 

 

90

90

ds

90

90

 

 

 

 

 

 

 

90

90

 

 

dw

90 di

90

 

 

 

 

90

90

 

90

90

 

 

 

 

dd

 

do

 

 

 

 

 

Figure 2-2: Top view of PCB and wire-wound Primary Coil of Power Transmitter design B5

Table 2-1: Primary Coil parameters of Power Transmitter design B5

 

Parameter

 

 

Symbol

 

 

Value

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Litz wire based Primary Coil

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Outer diameter

 

 

 

 

 

mm

 

 

 

 

 

 

 

 

 

 

 

Inner diameter

 

 

 

 

 

mm

 

 

 

 

 

 

 

 

 

 

Number of turns

 

 

 

 

11

 

 

 

 

 

 

 

 

 

 

 

PCB based Primary Coil

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Outer diameter

 

 

 

 

 

mm

 

 

 

 

 

 

 

 

 

 

 

Track width

 

 

 

 

 

mm

 

 

 

 

 

 

 

 

 

 

 

Track width plus spacing

 

 

 

 

 

mm

 

 

 

 

 

 

 

 

 

 

 

Corner rounding*

 

 

 

 

 

mm

 

 

Number of turns

 

 

 

 

11

 

 

 

 

 

 

 

 

 

 

*Value applies to the outermost winding

The Primary Coil array may be constructed from PCB-coils, wire-wound coils or any combination thereof (hybrid). Power Transmitter design B5 enables one-dimensional freedom of positioning. For that purpose the Primary Coils are placed in a row, such that there is an overlap of approximately two-thirds of

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© Wireless Power Consortium, July 2012


System Description

Wireless Power Transfer

Version 1.1 Addendum B5

Power Transmitter Designs

the area. Each Primary Coil (except for the Primary Coils at both ends of the Primary Coil array) overlaps with two Primary Coils in different layers. Figure 2-3 shows the layout of the Primary Coil array. Figure 2-4 shows the layered structure of the Primary Coil array in the case of a PCB only implementation, a Litz wire only implementation and a hybrid PCB-Litz wire implementation. Table 2-2 lists the relevant parameters of the Primary Coil array. Any layer of the PCB—if present—may contain functionality other than, or in addition to, the Primary Coils. If such other functionality is present, that functionality shall not affect the inductance values of the Primary Coils.

(a)

Primary Coil array

 

(b)

 

dh

Interface Surface

 

 

 

t2

t3

>5mm

 

 

 

 

 

 

 

Primary Coil

 

 

 

array

>2mm

Shielding

 

Figure 2-3: Top view (a) and cross section (b) of the Primary Coilarray of Power Transmitter design B5.

© Wireless Power Consortium, July 2012

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System Description

 

Wireless Power Transfer

Power Transmitter Designs

Version 1.1 Addendum B5

PCB

PCB top layer

d2

PCB layer 2

d1

PCB layer 3

d2

PCB layer 4

d1

PCB layer 5

d2

PCB layer 6

d1

PCB layer 7

2

d

PCB bottom layer

 

Litz

 

Hybrid

Cu

 

 

 

d

 

 

 

Cu

 

 

 

d

 

 

 

 

Litz-coil

c

Litz-coil

Cu

Layer 1

d

Layer 1

d

 

 

 

Cu

 

 

PCB top layer

d

 

 

 

 

Litz-coil

c

 

Cu

Layer 2

d

PCB layer 2

d

 

 

Cu

 

 

PCB layer 3

d

 

 

 

 

Litz-coil

c

 

Cu

Layer 3

d

PCB bottom layer

d

 

 

 

 

 

dCu

Interface

Surface

dCu dCu dCu dCu d2 d1 d2

Shielding

Figure 2-4: Layered structure of the Primary Coil array

Table 2-2: Primary Coil array parameters of Power Transmitter design B5

Parameter

Symbol

Value

Center-to-center distance

 

mm

 

 

 

Offset 2nd layer array

 

mm

Offset 3rd layer array

 

mm

Litz-layer thickness

 

mm

 

 

 

PCB-copper thickness

 

mm

 

 

 

Dielectric thickness 1

 

mm

 

 

 

Dielectric thickness 2

 

mm

 

 

 

2.1.1.1.2Shielding

As shown in Figure 2-3, Transmitter design B5 employs Shielding to protect the Base Station from the magnetic field that is generated in the Primary Coil array. The Shielding extends to at least 2 mm beyond the outer edges of the Primary Coil array, and is placed at a distance of at most mm below the Primary Coil array.

The Shielding consists of soft magnetic material that has a thickness of at least 0.5 mm. This version 1.1 Addendum B5 to the System Description Wireless Power Transfer, Volume I, Part 1, limits the composition of the Shielding to a choice from the following list of materials:

Material 78 — Fair Rite Corporation.

3C94 — Ferroxcube.

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© Wireless Power Consortium, July 2012


 

System Description

 

Wireless Power Transfer

Version 1.1 Addendum B5

Power Transmitter Designs

N87 — Epcos AG.

PC44 — TDK Corp.

Interface dz Surface

ds

Base

Primary Coil Array

Shielding

2 mm min.

 

 

 

 

Station

 

 

 

Figure 2-5: Primary Coil array assembly of Power Transmitter design B5

2.1.1.1.3Interface Surface

As shown in Figure 2-5, the distance from the Primary Coil array to the Interface Surface of the Base Station is mm, across the top face of the Primary Coil array. In addition, the Interface Surface extends at least 5 mm beyond the outer edges of the Primary Coil array.

2.1.1.2Electrical details

As shown in Figure 2-6, Power Transmitter design B5 uses a full-bridge inverter to drive the Primary Coil array. In addition, Power Transmitter design B5 uses a multiplexer to select the position of the Active Area. The multiplexer shall configure the Primary Coil array in such a way that one, or two Primary Coils are connected—in parallel—to the driving circuit. The connected Primary Coils together constitute a Primary Cell. In the case that two Primary Coils are selected, these two Primary Coils shall have an overlap of two-thirds of the area of a single Primary Coil.

Full-bridge

Inverter

 

 

 

 

Control

 

1

2

Lm

 

 

 

 

 

 

 

 

 

Multiplexer

Input

 

 

 

S

 

 

 

 

Voltage +

Control

 

Cm1

Cm23

 

 

 

 

 

 

 

 

 

 

3

4

 

 

Figure 2-6: Electrical diagram (outline) of Power Transmitter design B5

Within the Operating Frequency range

kHz, the assembly of Primary Coil array and Shielding

has an inductance of μH for each individual Primary Coil in layer (a) (closest to the Interface Surface), μH for each individual Primary Coil in layer (b), and μH for each individual Primary

Coil in layer (c) (closest to the Shielding). The capacitances and inductance in the impedance matching

© Wireless Power Consortium, July 2012

9


 

System Description

 

 

 

Wireless Power Transfer

 

 

Power Transmitter Designs

 

Version 1.1 Addendum B5

circuit are, respectively,

and

μH. The switch is open if

the Primary Cell consists of a single Primary Coil; otherwise, the swich

is closed. The input voltage to the

full-bridge inverter is

V. (Informative) The voltage across the capacitance

can reach levels

exceeding 36 V pk-pk.

 

 

 

Power Transmitter design B5 uses the phase difference between the control signals to two halves of the full-bridge inverter to control the amount of power that is transferred, see Figure 2-7. For this purpose, the range of the phase difference is 0…180 —with a larger phase difference resulting in a lower power transfer. In order to achieve a sufficient accurate adjustment of the power that is transferred, a type B5 Power Transmitter shall be able to control the phase difference with a resolution of 0.42 or better. When a type B5 Power Transmitter first applies a Power Signal (Digital Ping, see [Part 1], Section 5.2.1), it shall use an initial phase difference of 120 .

1

 

2

 

3

 

4

 

α

time

Figure 2-7: Control signals to the inverter

Control of the power transfer shall proceed using the PID algorithm, which is defined in [Part 1] Section 5.2.3.1. The controlled variable ( ) introduced in the definition of that algorithm represents the phase difference between the two halves of the full-bridge inverter. In order to guarantee sufficiently accurate power control, a type B5 Transmitter shall determine the amplitude of the current into the Primary Cell with a resolution of 5 mA or better. In addition to the PID algorithm, a type B5 Power Transmitter shall limit the current into the Primary Cell to at most 4 A RMS in the case that the Primary Cell consists of two Primary Coils, or at most 2 A RMS in the case that the Primary Cell consists of one Primary Coil. Finally, Table 2-3 provides the values of several parameters, which are used in the PID algorithm.

Table 2-3: Control parameters for power control

 

Parameter

 

 

Symbol

 

 

Value

 

 

Unit

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Proportional gain

 

 

 

 

1

 

 

mA-1

 

 

Integral gain

 

 

 

 

0

 

 

mA-1ms-1

 

 

Derivative gain

 

 

 

 

0

 

 

mA-1ms

 

 

Integral term limit

 

 

 

 

 

N.A.

 

 

N.A.

 

 

 

 

 

 

 

 

 

 

 

 

 

PID output limit

 

 

 

 

2,000

 

 

N.A.

 

 

 

 

 

 

 

 

 

 

 

 

 

Scaling factor

 

 

 

 

0.01

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2.1.1.3Scalability

Power Transmitter Design B5 offers the same scalability options as Power Transmitter design B1. See [Part 1], Section 3.3.1.3.

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© Wireless Power Consortium, July 2012